E22-900M33S SX1262 LoRa spread spectrum wireless module 868MHz/915MHz, SPI

[Chip solution]:SX1262

[Communication distance]: 16km

[Product size]:24*38.5mm

[Product weight]:5.1g±0.1g

[Introduction]:E22-900M33S is independently developed based on the new generation LoRa radio frequency chip SX1262 produced by Semtech in the United States. It has a maximum power of 2W and is suitable for 868/915MHz patch-type LoRa wireless modules. It uses an industrial-grade high-precision 32MHz crystal oscillator. Compared with the previous generation LoRa transceiver, the anti-interference performance and communication distance have been improved, further widening the gap with products with FSK and GFSK modulation methods. This product can cover an ultra-wide applicable frequency range of 850 to 930MHz and is backward compatible with SX1278 and SX1276. Since this module is a pure radio frequency transceiver module, it needs to use an MCU driver or a dedicated SPI debugging tool.

ZZteco

ZZteco

ZZteco

ZZteco

ZZteco


Main parametersPerformance Remark
Minimum valueMaximum value
Supply voltage (V)3.35.5Exceeding 5.5V will permanently burn the module
Blocking power (dBm)-10Less likely to be burned if used at close range
Working temperature (℃)-4085Industrial grade
Main parametersPerformance Remark
Minimum valueTypical valueMaximum value
Supply voltage (V)3.355.5≥5.0V guaranteed output power
Communication level (V)-3.3-Using 5V TTL risks burning out
Working temperature (℃)-40-85Industrial grade design
Working frequency band (MHz)850868/915930Support ISM band
Power consumptionEmission current (mA)-1200-±100mA(33dBm&5V)
Receive current (mA)-15--
Sleep current (uA)-2-Software shutdown
Maximum transmit power (dBm)32.53333.5The output power of the RF chip cannot be greater than 9dBm
Receiving sensitivity (dBm)-134-135-136LoRaSF9
Main parametersDescription Remark
reference distance16kmSunny and open space, antenna gain 5dBi, antenna height 2.5 meters, air rate 0.3kbps
FIFO256ByteMaximum length of a single send
Crystal frequency32MHz-
ModulationLoRa(recommended)-
Packaging methodSMD type-
Interface mode2.54mmstamp hole
Communication InterfaceSPI0~10Mbps
Dimensions38.5*24mm-
Antenna interfaceStamp hole/IPEXEquivalent impedance is about 50Ω
weight5.1g±0.1g


ZZteco

No.  PinPin Direction Remarks
1GND-Ground wire, connected to the power reference ground
2GND-Ground wire, connected to the power reference ground
3GND-Ground wire, connected to the power reference ground
4GND-Ground wire, connected to the power reference ground
5GND-Ground wire, connected to the power reference ground
6RXENinput RF switch receiving control pin, connected to external microcontroller IO, high level active
7TXENinput RF switch emission control pin, connected to external microcontroller IO or DIO2, active at high level
8DIO2input /OutputConfigurable general-purpose IO port (see SX1262 manual for details)
9VCC-Power supply, range 3.3V~5.5V (it is recommended to add external ceramic filter capacitors)
10VCC-Power supply, range 3.3V~5.5V (it is recommended to add external ceramic filter capacitors)
11GND-Ground wire, connected to the power reference ground
12GND-Ground wire, connected to the power reference ground
13DIO1input /OutputConfigurable general-purpose IO port (see SX1262 manual for details)
14BUSYOutputUsed for status indication (see SX1262 manual for details)
15NRSTinput Chip reset trigger input pin, active low level
16MISOOutputSPI data output pin
17MOSIinput SPI data input pin
18SCKinput SPI clock input pin
19NSSinput Module chip select pin, used to start an SPI communication
20GND-Ground wire, connected to the power reference ground
21ANT-Antenna interface, stamp hole (50 ohm characteristic impedance)
22GND-Ground wire, connected to the power reference ground