[Chip]：LLCC68
[Working frequency]：850MHz～930MHz
[Transmit power]：22dBm
[Distance]：6km
[Size]：10*10*2.5mm
[Weight]：0.5g±0.02g
[Introduction]：E220-900MM22S is an ultra-small volume independently developed based on a new generation of LoRaTM RF chip LLCC68 produced by Semtech, and is suitable for 868MHz, 915MHz SMD LoRaTM wireless modules, using industrial grade 32MHz crystal oscillator.
| Hardware Parameters | Parameter Value | Remark |
| Crystal oscillation frequency | 32MHz | - |
| Package - | SMD | - |
| Connector | stamp hole | Spacing 1.27mm |
| Communication interface | SPI | 0-10Mbps |
| Size | 10* 10*2.5 mm | With shield |
| Net weight | 0.5g±0.02g | |
| RF interface | stamp hole | - |
| Main Parameter | Performance | Remark | |||
| Min. | Type | Max. | |||
| Operating voltage（V） | 1.8 | 3.3 | 3.7 | ≥3.3V can guarantee the output power, more than 3.7V will permanently burn the module | |
| Communication level（V） | - | 3.3 | - | Risk of burnout with 5V TTL | |
| Operating temperature（°C） | -40 | +85 | Industrial grade design | ||
| power consumption | TX current （mA） | - | 100 | - | Instantaneous power consumption |
| RX current （mA） | - | 10 | - | - | |
| Sleep current （uA） | - | 1.2 | - | software shutdown | |
| RF Parameter | Parameter Value | Remark | |
| Operating frequency | 850MHz～930MHz | Support ISM | |
| Transmit power | 21dBm～22dBm | The software is adjustable and needs to be developed and set by | |
| Receiving sensitivity | -129dBm | BW_L=250kHz，SF = 10，LORATM | |
| FIFO | 256Byte | Maximum length of single transmission | |
| Modulation mode LoRa | LoRa | LoRa modulation is recommended | |
| Blocking power | 10dBm | The probability of burning at close range is small | |
| Air rate LoRa | LoRa（bps） | 1.76k～62.5k | User programming control |
| Reference distance | 5500m | Clear and open environment, antenna gain 5dBi, 2.5 2.5 meters, air rate 2.4kbps meters, air rate 2.4kbpsantenna height | |
| Pin No. | Item | Direction | Description |
| 1 | VCC | - | Power supply, range 1.8V~3.7V (recommended to add external ceramic filter capacitor) |
| 2 | GND | - | Ground wire, connected to the power reference ground |
| 3 | NRST | Input | NRST Input Chip reset trigger input pin, active low |
| 4 | NC | - | - |
| 5 | NC | - | - |
| 6 | ANT | - | RF interface, stamp hole |
| 7 | GND | - | Ground wire, connected to the power reference ground |
| 8 | NC | - | - |
| 9 | TXEN | Input | RF switch launch control pin, connected to external microcontroller IO |
| 10 | RXEN | Input | RF switch receiving control pin, connected to external microcontroller IO, active high |
| 11 | BUSY | Output | Used for status indication (see LLCC68 manual for details) |
| 12 | MISO | Output | SPI data output pin |
| 13 | MOSI | Input | SPI data input pin |
| 14 | NSS | Input | Module chip select pin for starting an SPI communication |
| 15 | SCK | Input | SPI clock input pin |
| 16 | GND | - | Ground wire, connected to the power reference ground |
| 17 | NC | - | - |
| 18 | DIO3 | Input/Output | Configurable general-purpose IO port (see LLCC68 manual for details) |
| 19 | DIO2 | Input/Output | Configurable general-purpose IO port (see LLCC68 manual for details) |
| 20 | DIO1 | Input/Output | Configurable general-purpose IO port (see LLCC68 manual for details) |
