E22-400M33S 433/470MHz 33dBm SX1268 chip wireless module 16km long range rf wireless transceiver module

[Chip solution]:SX1268

[Carrier frequency]:410~493MHz

[Power]:33dBm

[Communication interface]:SPI

[Communication distance]:16km

[Product size]:24*38.5mm

[Product weight]:4.9±0.1g

[Introduction]:E22-400M33S is based on the new generation of LoRaTM RF chip SX1268 produced by Semtech in the United States as the core of independent research and development of the maximum power of 2W and suitable for 433/470MHz SMD LoRaTM wireless module, using industrial-grade high-precision 32MHz crystal oscillator.

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Main parametersPerformanceRemarks
MiniTypMax
Operating Voltage(V)3.355.5≥5.0V Guaranteed output
power
Communication level(V)-
3.3-
Risk of burnout with 5V TTL
Operating temperature(°C)-40-+85Industrial grade design
Operating Frequency Band(MHz)410433/470493ISM band support
Power
consumption
Emission current(mA)-
650-
Instantaneous power
consumption
Receiving current(mA)-
14-
-
Dormant current (uA)-
2-
Software shutdown
Maximum transmitting power(dBm)32.53333.5-
Reception sensitivity(dBm)-124-125-126Airspeed 0.3kbps
airspeed(bps)0.6k-300kUser-programmed control
0.018k-62.5kUser-programmed control
Main parametersDescriptionRemarks
Reference Distance16kmClear and open, antenna gain 5dBi, antenna height 2.5m, air rate
0.3kbps
FIFO256ByteMaximum length of a single transmission
Crystal Frequency32MHz-
Modulation modeLoRa(Recomm
end)
-
Packaging methodSMD-
Interface method2.54mmStamp Holes
Communication InterfaceSPI0~10Mbps
Dimension38.5*24mm-
Antenna interfaceStamp Holes/IPEXEquivalent impedance about 50Ω
Limit parametersPerformanceRemarks
MiniMax
Supply Voltage(V)05.5Permanent module burnout above 5.5V
Blocking power(dBm)-10The probability of burning is small when used in
close proximity
Operating temperature(°C)-40+85industrial grade


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Pin Serial
Number
Pin NamePin OrientationPin Usage
1GND-

Ground wire, connected to power reference ground

2GND-

Ground wire, connected to power reference ground

3GND-

Ground wire, connected to power reference ground

4GND-

Ground wire, connected to power reference ground

5GND-

Ground wire, connected to power reference ground

6RXENInput

RF switch receive control pin, connected to external microcontroller IO, active high


7TXENInput

RF switch transmit control pin, connected to external microcontroller
IO or DIO2, active high


8DIO2Input/Output

Configurable general-purpose IO ports (see SX1268 manual for details)

9VCC-

Power supply, range 3.3 to 5.5V (it is recommended to increase the
external ceramic filter capacitor)

10VCC-

Power supply, range 3.3 to 5.5V (it is recommended to increase the
external ceramic filter capacitor)

11GND-

Ground wire, connected to power reference ground

12GND-

Ground wire, connected to power reference ground

13DIO1

Input/Output

Configurable general-purpose IO ports (see SX1268 manual for details)

14BUSYOutput

For status indication (see SX1268 manual for details)

15NRSTInput

Chip reset trigger Input pin, active low

16MISOOutput

SPI Data Output Pin

17MOSIInput

SPI Data Input Pin

18SCKInput

SPI Data Input Pin

19NSSInput

Module chip select pin to start an SPI communication

20GND-

Ground wire, connected to power reference ground

21ANT-

Antenna connector, stamp hole (50Ω characteristic impedance)

22GND-

Ground wire, connected to power reference ground