[IC]：LLCC68
[Frequency]：850.125~930.125MHz
[Power]：30dBm
[Distance]：10km
[Size]：38.5*24mm
[Product weight]：5.1g±0.1g
[Introduction]：E220-900M30S is 1W module developed independently based on new generation of LoRa RF chip LLCC68 from Semtech. LLCC68 is suitable for 868MHz/915MHz SMD wireless module and uses industrial 32mhz crystal oscillator.
| Main parameter | Performance | Remarks |
|---|---|---|
| Reference distance | 10km | In clear and open environment, the antenna gain is 5dBi, the antenna height is 2.5m, and the air speed is 2.4kbps. |
| FIFO | 256Byte | Maximum length of single transmission |
| Crystal frequency | 32MHz | Passive crystal oscillator, 24pF is recommended |
| Modulation mode | LORA | Lora modulation is recommended |
| Packaging method | SMD | - |
| Interface mode | Stamp hole | The spacing is 2.54mm |
| Communication interface | SPI | 0~10Mbps |
| Dimension | 38.5*24mm | Including shield |
| RF interface | Stamp hole / IPEX | - |
| Main parameter | Min. | Typ. | Max. | Unit | Remarks |
|---|---|---|---|---|---|
| Working voltage | 3 | 5 | 5.5 | V | ≥5.5 V ensures output power |
| Operating frequency band | 850 | 868/915 | 930 | MHz | Support ISM band |
| Communication level | - | 3.3 | - | V | Probably burnout when using 5V TTL |
| TX current | - | 700 | - | mA | Instantaneous power consumption |
| RX current | - | 14 | - | mA | - |
| Sleep current | - | 0.7 | - | μA | Software shutdown |
| Working temperature | -40 | - | +85 | ℃ | Industrial Design |
| Max TX power | 29.5 | 30 | 30.5 | dBm | - |
| Receiving sensitivity | - | -129 | - | dBm | -124dbm,BW_L=125kHz,SF = 7,LORA TM; -129dbm,BW_L=125kHz,SF = 9,LORA TM; -121dbm,BW_L=250kHz,SF = 7,LORA TM; -129dbm,BW_L=250kHz,SF = 10,LORA TM; -117dbm,BW_L=500kHz,SF = 7,LORA TM; -127dbm,BW_L=500kHz,SF = 11,LORA TM; |
| GFSK（bps） | 0.6k | - | 300k | bps | User programming control |
| LoRa（bps） | 1.76k | - | 62.5k | bps | User programming control |
| Pin No. | Item | Direction | Description |
|---|---|---|---|
| 1 | GND | - | Ground, connect to power reference ground |
| 2 | GND | - | Ground, connect to power reference ground |
| 3 | GND | - | Ground, connect to power reference ground |
| 4 | GND | - | Ground, connect to power reference ground |
| 5 | GND | - | Ground, connect to power reference ground |
| 6 | RXEN | Input | RF switch receive control pin, connect external MCU IO, high level effective |
| 7 | TXEN | Input | RF switch emission control pin, connected to external MCU IO or dio2,high level effective |
| 8 | DIO2 | Input / output | Configurable universal IO port (see llcc68 manual for details) |
| 9 | VCC | - | Power supply, range 3V ~ 5.5V (it is recommended to add ceramic filter capacitor externally) |
| 10 | VCC | - | Power supply, range 3V ~ 5.5V (it is recommended to add ceramic filter capacitor externally) |
| 11 | GND | - | Ground, connect to power reference ground |
| 12 | GND | - | Ground, connect to power reference ground |
| 13 | DIO1 | Input / output | Configurable universal IO port (see LLCC68 manual for details) |
| 14 | BUSY | Output | For status indication (see LLCC68 manual for details) |
| 15 | NRST | Input | Chip reset trigger input pin, low level effective |
| 16 | MISO | Output | SPI data output pin |
| 17 | MOSI | Input | SPI data input pin |
| 18 | SCK | Input | SPI data input pin |
| 19 | NSS | Input | The module chip selection pin is used to start a SPI communication |
| 20 | GND | - | Ground, connect to power reference ground |
| 21 | ANT | - | RF interface, stamp hole |
| 22 | GND | - | Ground, connect to power reference ground |
